Modeling Methodology for On-Chip Coplanar Transmission Lines over the Lossy Silicon Substrate
نویسندگان
چکیده
This paper presents a wideband modeling methodology for on-chip coplanar single and coupled transmission lines over the conductive silicon substrate. Cost effective, semi analytical models have been developed, being purely based on explicit expressions. Silicon substrate induced loss and dispersion effects are considered, as well as the skin and proximity effects, while accounting for thick metals. The models have been verified against both numerical computations (full wave HFSS and quasi-static SI2D and EM2D solvers) and hardware measurements (40 GHz VNA measurements on dedicated test sites).
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